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Wafer Handling Engineer (m/f/x)
ZEISS Group · Oberkochen
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Job description
ZEISS Semiconductor Manufacturing Technology
Enabler for smaller, more powerful, and more energy-efficient microchips
Working for tomorrow today.
Around 80 percent of all microchips worldwide are produced using ZEISS technologies. As the centerpiece of every electronically controlled system, they have become an integral part of our everyday lives – whether in smartphones, smart homes or smart factories. ZEISS is a technology leader in the field of semiconductor manufacturing equipment. With high-precision lithography optics, photomask systems and process control solutions, ZEISS enables the production of ever smaller, increasingly powerful, and more energy-efficient microchips, and thus plays a pivotal role in the age of micro- and nanoelectronics.
Semiconductor Fab Solutions (SFS) develops electron microscopy solutions for quality control in the semiconductor industry.
Become part of the team behind groundbreaking innovations like the “ZEISS MultiSEM” and help push the boundaries of technology every day. You’ll work closely with people from a wide variety of disciplines. Take on the challenge and grow through exciting and responsible assignments. Join us at our inspiring location in Oberkochen, where you’ll have the opportunity to advance your career in a forward-looking environment.
Your Role
Take ownership of wafer handling qualification within advanced semiconductor equipment, with focus on safe, repatable, and traceable wafer movement through the complete system
Define, execute, and improve qualification strategies for wafer transfer, alignment, buffering, handover points, mapping, and substrate tracking
Integrate wafer handling modules into the overall system and validate the interaction between mechanics, automation, software, process modules, and system control
Analyze wafer movement issues such as wafer slip, misalignment, transfer aborts, mapping deviations, handover instabilities, collision risks, and handling-related particle risks
Lead structured root cause analysis for wafer handling incidents and translate findings into corrective actions, design improvements, test coverage, and lessons learned
Establish meaningful KPIs for wafer handling performance, including transfer reliability, recovery behavior, first-pass qualification rate, throughput impact, and recurring issue rate
Support prototype build, commissioning, factory acceptance, system qualification, production transfer, and early customer ramp-up for wafer handling relevant functions
Create clear documentation for error patterns, problem descriptions, root causes, countermeasures, verification status, and ownership of follow-up actions
Act as cross-functional interface between System Engineering, Automation, Mechanics, Software/System Test, Application, Process, Service, and Production
Drive continuous improvement of wafer flow robustness, system availability, serviceability, and customer readiness
Your Profile
University degree in Mechanical Engineering, Mechatronics, Automation Engineering, Physics, Semiconductor Technology, or a comparable technical field
Practical experience with semiconductor equipment, complex electro-mechanical systems, robotics, automation, or wafer handling functions
Strong understanding of system qualification, integration testing, acceptance criteria, and structured verification of complex tool behavior
Hands-on mindset in laboratory, cleanroom, prototype, or production-near environments
Ability to analyze technical issues using data, test observations, logs, and structured problem-solving methods such as 8D, Ishikawa, FMEA, or similar approaches
Strong communication skills and the ability to align technical decisions across interdisciplinary and international teams
Very good English skills; German is an advantage and willingness to support commissioning, production transfer, and customer-relevant activities when needed
Your ZEISS Recruiting Team: Oliver Reith
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