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Subproject Manager - Imaging EUV Metrology (m/f/x)

ZEISS Group · Jena

Jena · On-siteFull-TimePosted Jun 10, 2026

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Job description

ZEISS Semiconductor Manufacturing Technology​

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Enabler for smaller, more powerful, and more energy-efficient microchips​

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Working for tomorrow today. ​

Around 80 percent of all microchips worldwide are produced using ZEISS technologies. As the centerpiece of every electronically controlled system, they have become an integral part of our everyday lives – whether in smartphones, smart homes or smart factories. ZEISS is a technology leader in the field of semiconductor manufacturing equipment. With high-precision lithography optics, photomask systems and process control solutions, ZEISS enables the production of ever smaller, increasingly powerful, and more energy-efficient microchips, and thus plays a pivotal role in the age of micro- and nanoelectronics.

Your role

As a Subproject Manager (Sub-Function Owner) you will:

gather, coordinate and manage requirements for the image acquisition system and its interfaces definition at multi-disciplinary level

provide project leadership to an agile development team and be responsible for their backlog for the design and development of image acquisition unit for a mask inspection machine in semiconductors industry

supported by functional architects and Scrum Masters, you will assume responsibility for your functional team and its deliverables

find and evaluate solutions and risks from both technical and economic perspectives

manage internal and external development partners agilely using clearly defined KPIs

be responsible for the execution of performance roadmap for the image acquisition modules to meet future product requirements

provide target group-oriented reporting on the project status of the functional and corresponding documentation of the development results

Your profile

a successfully completed degree in a natural science or engineering field with a focus on optics/mechatronics/systems engineering

proven experience in managing complex, cross-functional projects in the semiconductor domain with full proficiency in project planning, resource allocation, risk management, and meeting deadlines, Project Management certification (e.g., PMP, Agile) preferred

ability to lead multidisciplinary teams, including engineers, designers, and external vendors with strong interpersonal and communication skills to ensure alignment across stakeholders

capability to identify and resolve technical challenges efficiently as well as executing technology roadmap to improve system performance and reliability

team spirit and enjoyment of working in a globally operating team

proficiency in both German and English (excellent written and spoken)

Your ZEISS Recruiting Team: Janina Kalmbach

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