Engineer, QA (Process Quality Control)

Position Summary

The

Engineer, QA (Process Quality Control)

is responsible to develop & deploy inspection procedures to ensure conformance of material to be released. Candidates with experience in semiconductor manufacturing environment are encouraged to apply for this position.

Responsibilities

Lead PQC engineers and inspectors in performing yield and product gating checks, ensuring alignment with production goals and driving performance improvement.

Responsible for backend semiconductor packaging processes including ball drop, bumping, singulation, backgrind, and mounting.

Develop or enhance procedures and work instructions related to backend PQC processes.

Provide engineering support to meet targets for output, product quality, efficiency, yield, cycle time, and safety.

Perform data analysis using statistical tools, summarize findings, and present results to relevant stakeholders for alignment, action, and strategic decision-making.

Drive and facilitate meetings to mitigate yield loss, create action roadmaps, and implement continuous improvement strategies with cross-functional teams.

Identify chronic process and quality issues and implement permanent corrective actions.

Responsible for new product process development and supporting smooth pilot-to-high volume transitions.

Collaborate with OSAT process/integration teams to resolve process-related defects impacting yield and product quality.

Ensure the relevance and accuracy of Work Instructions, Control Plans, FMEA, and other process control documents.

Ensure audit readiness for internal and external audits and manage timely closure of findings.

Any other ad-hoc duties as assigned.

Requirements

Bachelor’s Degree in Engineering (Mechanical, Electrical, Materials, Chemical, or a related field).

Minimum 5 years of relevant experience in backend semiconductor packaging processes.

Strong foundation in process engineering, yield improvement, and quality control.

Proficient in SPC and data analysis tools.

Familiarity with FMEA, Control Plans, and OSAT backend processes.

Hands-on experience with new product and process evaluations.

Effective communicator; capable of presenting data and driving cross-team collaboration.

Able to thrive in a fast-paced, high-volume manufacturing environment.

Silicon Box Pte Ltd is one of Asia’s fastest growing technology unicorn, at the forefront of semiconductors integration, emerging from the new horizon of Chiplets integration trends in the semiconductor industry, driven by the needs of "dis-integration", benefits of faster time-to-market and lower cost of new device design.

We provide services of semiconductor design of Chiplets at the leading edge of semiconductor device integration scheme with the next generation of advanced packaging manufacturing technologies.